Designed for HPC
Heat dissipation requirements for AI chips with power consumption of 1000W up
Effectively transfers heat to the coolant quickly
Spreads localized heat across the entire heatsink base via the ultra-high thermal conductivity of diamond-copper, ensuring rapid dissipation into the coolant
Alleviating thermal stress and strain
Under specific conditions, diamond-copper's superior CTE compatibility allows for a rigid attachment to the chip material.
Optimizing for lightweight design
Diamond-copper features a density just 60% of traditional copper. Combined with optimized flow channels and hollow designs, it delivers a weight savings of more than 30%, enabling a truly lightweight design.
